doc. no : qw0905- rev. : date : data sheet lg5230/f792-pf ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps 29 -jan. - 2013 lg5230/f792-pf b lead-free parts pb l dcc
60 ? ? ? note : 1.all dimension are in millimeter tolerance is
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 100 -40 ~ +100 -40 ~ +85 ir10 ratings g 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 110 viewing angle 2 1/2 (deg) min. 3.0 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 565 spectral halfwidth nm 30 typ. luminous intensity @10ma(mcd) 6.0 emitted green part no lg5230/f792-pf material gap lens color green diffused part no. lg5230/f792-pf
ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current 1000 100 10 forward current(ma) 1.0 5.0 4.0 3.0 2.0 forward voltage(v) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a g chip 1000 10 1.0 1.0 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 100 40 20 06080 0.0 100-40 020406080 ambient temperature(
dip soldering preheat: 120 50 0 0 preheat 25 120 150 100 time(sec) 260 260
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230
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